The 5G enabled Dimensity 8100 SoC built on TSMC’s advanced 5nm process technology has 25% better CPU power efficiency over previous Dimensity chips. Combined with LPDDR5 RAM and UFS 3.1 storage the device elevates the gaming experience to new heights. The device can maintain sustained peak performance owing to the better heat dissipation via a large vapor chamber cooling system with 7 layers of graphite
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